OMET Americas Presents Future of Flexo Event at Clemson’s Sonoco Institute

CLEMSON, SC—On Feb. 6-7, an inaugural Future of Flexo event was hosted at Clemson University’s Sonoco Institute of Packaging Design and Graphics, presented by OMET Americas. The event centered around “New Year, New Technology” and was sponsored by industry print suppliers Eaglewood Technologies, Siegwerk, Phoseon Technology, Nazdar Ink Technologies, DuPont, Techkon USA, DBT Coatings and … Continued

The Expanding Role of Premedia Companies in Package Prototyping

When the creators of the National Biscuit Co (Nabisco) entered American retail in the 1890s with their first branded and nationally marketed packaging—Uneeda Biscuits—they would never have imagined the kind of convoluted and expensive movement they had just started. Trillions of dollars later, packaging’s protective properties have become equally important to its “decoration.” Packaging materials … Continued

MacDermid Graphics Solutions Sponsors Graphic Communications Scholarship at Clemson University

ATLANTA, GA—MacDermid Graphics Solutions announced the MacDermid Graphics Solutions Scholarship in Graphic Communications (GC) at Clemson University. This scholarship is meant to help attract and retain exceptional student talent in GC for Clemson and the graphics arts industry. Clemson’s GC program is top-ranked in the U.S. and has a global reputation for its outstanding faculty, students … Continued