CLEMSON, SC—On Feb. 6-7, an inaugural Future of Flexo event was hosted at Clemson University’s Sonoco Institute of Packaging Design and Graphics, presented by OMET Americas. The event centered around “New Year, New Technology” and was sponsored by industry print suppliers Eaglewood Technologies, Siegwerk, Phoseon Technology, Nazdar Ink Technologies, DuPont, Techkon USA, DBT Coatings and … Continued
MIDLAND, MI—Dow is launching its call for entries for the 2019 Packaging Innovation Awards. Submissions for the international awards program will be accepted from Jan. 22 through March 29 on the Dow Packaging Innovation Awards website. This is the second year Dow is the title sponsor of the globally recognized awards program, carrying on the … Continued
CLEMSON, SC—OMET Americas is hosting its first open house at Clemson University’s Sonoco Institute of Packaging Design and Graphics on Feb. 6-7 in Clemson, SC. Join the free event to connect with vendors from across the flexo industry. Explore their latest technologies to determine which industry advancements you should consider for your 2019 budget planning. … Continued
Measuring Samples from the Forum 2018 Print Project at Different Locations This is the last in a series of articles chronicling the wide web, flexible packaging pouch job at the center of the Forum 2018 FIRST in Motion session. Other articles in the series include: FIRST in Motion: Objectives by FTA Hall of Fame Member … Continued
The phrase “Bringing It All Together” may have only applied to the four days of Forum 2018—after all, that was its official theme. But the idea extended both before and after the early May event, with flexographers seeing it play out during the entire year. From Forum and INFOFLEX in May, to Labelexpo Americas in … Continued